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Aufbau- und Verbindungstechnik in der Sensor– und Halbleitertechnologie

CIT443040Examination Performance3 ECTSGerman/Englishsummer semesterDepartment Electrical Engineering
AI-edited module sheet. Based on the TUMonline module description, edited for readability.Original in TUMonline

What it is about

You will learn industrial assembly and interconnection techniques for sensors and semiconductor products. You understand manufacturing and production processes of electronic components up to mass production and can classify and apply typical procedures such as wafer processes, die bonding, wire bonding and encapsulation.

What you will be able to do

  • Know and apply manufacturing and production processes for a finished product
  • Identify and analyze characteristics and properties of assembly and interconnection techniques
  • Evaluate and select suitable techniques and procedures depending on the task

What the module consists of

  • BlockvorlesungConveying the technical content
  • ÜbungDeepening through case studies, short presentations and teamwork

Teaching method

  • VorlesungConveying the basics, properties and standards
  • Übungen mit Fallbeispielen und KurzreferatenTargeted deepening and application of the content; team or individual work
  • praktische Demonstrationen und mediale ZusatzmaterialienEstablishing the connection between scientific methodology and industrial practice
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Official page in TUMonline · Details are not binding.